The new nano-copper powder product of GRIPM Advanced Materials' (SHA:688456) unit, Chongqing Youyan Chongye New Materials, passed customer verification, according to a Shanghai Stock Exchange filing on Jan. 22.
The evaluation showed that the product has better sintering performance than the same type of nano-copper powder at home and abroad, meeting the international demand of electronic paste for high-end raw materials of low-temperature sintering paste.
The product can be widely used in new copper-based paste material products for printed circuit board interconnection, power chip packaging and assembly, among other uses, the Chinese manufacturer of nonferrous metal powders said.
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