China Silver Technology Holdings (HKG:0515) plans to issue up to HK$100.0 million of bonds in four tranches through placement to third parties, according to a Tuesday filing with the Hong Kong bourse.
The interest rate on the bonds is 8% per annum. The four tranches, Bonds A, Bonds B, Bonds C, and Bonds D, will mature on the first business day after the expiry of the 12th, 24th, 36th, and 48th months, respectively, based on the date of the relevant bonds' first issue.
The proceeds from the bonds will be used for the financial obligations of the group, investment and acquisition opportunities, and general working purposes.
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